Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
IEEE Computer Society
Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
EI
ISSN:2150-5934
e-ISSN:2150-5942
详情
出版商:
IEEE Computer Society
国家:
United States
学科1:
Hardware and Architecture
学科2:
Control and Systems Engineering
学科3:
Electrical and Electronic Engineering
学科4:
-
学科5:
-
学科6:
-
学科7:
-
学科8:
-
OA:
NO
官网:
—
是否在库:
是