期刊详情
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JOURNAL DETAIL
Journal of Microelectronics and Electronic Packaging

Journal of Microelectronics and Electronic Packaging

EI
ISSN:1551-4897
e-ISSN:—

详情

出版商:
IMAPS-International Microelectronics and Packaging Society
国家:
United States
学科1:
Computer Networks and Communications
学科2:
Electrical and Electronic Engineering
学科3:
Electronic, Optical and Magnetic Materials
学科4:
-
学科5:
-
学科6:
-
学科7:
-
学科8:
-
OA:
NO
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